Mechanic Qc-20 Glue Removing Liquid

Key Features & Specifications

• Adhesive Compatibility: Effectively breaks down solidified resin adhesives, including epoxy, phenolics, acrylate, polyurethane, and organosilicon.
• Safety Profile: A benzene-free and environmentally friendly formula that is non-corrosive to PCBs and surrounding electronic components.
• Volume: Typically supplied in a 20ml bottle.
• Chemical Properties: Classified as a weak acid; the bottle may contain internal air pressure, so it should be opened with care. 

   

How to Use

1. Preparation: Dip a piece of absorbent cotton (larger than the target IC) into the liquid.
2. Application: Place the soaked cotton over the BGA IC and cover the area with plastic film to prevent evaporation. Let it sit for approximately 20 minutes.
3. Soft Removal: Use tweezers to gently peel away the softened outer sealant.
4. Heat Extraction: Use a hot air tool at approximately 300°C to melt the adhesive underneath the chip before lifting it with precision tweezers.