MECHANIC 900M-T-C9 SOLDERING STATION
The
is a specialized 7-in-1 miniature heating platform designed to fit onto a standard soldering iron, primarily used for precision repairs on smartphone motherboards. It is most commonly used for tasks like IC glue removal, Face ID flex cable repair, and BGA chip desoldering.
Key Features and Applications
This tool acts as a "miniature heating table" that replaces a traditional soldering tip to provide a broader, controlled heating surface.
- Targeted Microsoldering: Ideal for removing and installing internal connectors, Face ID cables, and FPC components without the risk of bulging or deformation often caused by hot air guns.
- Glue and Chip Removal: Specifically designed for A8 through A14 CPU chip glue removal and general BGA chip degumming.
- Rapid Heat Transfer: Constructed from 99.99% pure copper, ensuring quick temperature rise and high thermal conductivity.
- Operating Ranges: Technicians typically use it at 180°C–200°C for shielding cover removal and glue cleaning, or 230°C–240°C for dedicated CPU removal.
