Key Features of the KJ003 Platform
- Precision Positioning: Features dedicated structures for rapid, automatic alignment of the A11 CPU and motherboard layers without manual adjustment.
- Heat Management: Built with high-temperature resistant materials and explosion-proof cooling features to protect sensitive ICs from thermal damage during hot air gun use.
- Integrated Tin Planting: Includes precision stencils and a secure base to ensure accurate solder ball placement for reballing operations