2UUL DW11 Solder Away Desoldering Wick 2015 For Mobile Phone Repair

2uul DW11 Solder Away 2.0mM Desoldering Wick for Cleaning PCB Soldering Slag
 

Key Features and Specifications:

• Material: Made from high-purity, oxygen-free braided copper wire, designed for excellent thermal conductivity.

• Dimensions: The standard size is 2.0 mm (width) x 1.5 m (length), commonly referred to as the "2015" size in product listings.

• Performance: Features a thin and soft flat braid design that promotes strong capillary action to pull in excess solder quickly, minimizing the risk of heat damage to sensitive components and the PCB.

• Residue: It has a "fluorine-free with less residue" design, ensuring a good cleaning effect and eliminating the need for post-desoldering cleaning in many cases.

• Anti-Oxidation: Refined with a special chemical formula that makes it resistant to oxidation and corrosion.

• Usage: Used in mobile phone and computer motherboard repair, BGA reballing, and general electronic assembly corrections. 

Package includes:

• 1* Solder Wick